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We report on a theoretical study of the electronic structure of free-standing InAs and InP nanowires grown along the [100] crystallographic direction, based on an atomistic tight-binding approach. The band structure and wave functions for nanowires with both square (nanowires) and rectangular (nanobelts) cross sections are calculated. A comparison is made between the calculations for InAs, InP, an
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Households play a crucial role in the management of waste electrical and electronic equipment (WEEE). As waste generators, their decisions at the point of disposal hold a key to a success of WEEE collection. This article presents main findings from a national survey in Thailand about the reported disposal behaviors in the past and the stated disposal preferences in the future. The survey covered t
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The high computational complexity of acoustic echo cancellation algorithms requires application specific implementations to sustain real time signal processing with affordable power consumption. This is especially true for systems where a delayless approach is considered important, e.g. wireless communication systems. The proposed paper presents architectural considerations to reach a feasible har
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In this paper we have proposed a test cost model for core-based 3D Stacked ICs (SICs) connected by Through Silicon Vias (TSVs). Unlike in the case of non-stacked chips, where the test flow is well defined by applying the same test schedule both at wafer sort and at package test, the most cost-efficient test flow for 3D TSV-SICs is yet undefined. Therefore, analysing the various alternatives of tes